Roper Technologies $1.5 billion 3.65%, 4.2% notes issue

28/8/2018
Investment grade bond/note issue

$ 1.5 billion

Announced

28/8/2018


Overview:

  •  The placement consists of $700 million 3.65% notes due 2023 and $800 million 4.2% notes due 2028.

Daniel Semerdzhiev - Data analyst

Jurisdiction:

United States

Deal type:

Investment grade bond/note issue

Practice area:

Capital markets : Debt

Governing laws:

New York
United States

Industry sector:

Industrials and manufacturing


Firms:

Party: Roper Technologies (Issuer)


Party: JP Morgan Securities (Underwriter)

Party: Bank of America Merrill Lynch (Underwriter)

Party: Wells Fargo Securities (Underwriter)

Party: MUFG Securities Americas (Underwriter)

Party: PNC Capital Markets LLC (Underwriter)

Party: SunTrust Robinson Humphrey (Underwriter)

Party: TD Securities (Underwriter)

Party: BB&T Corporation (Underwriter)

Party: RBC Capital Markets (Underwriter)

Party: Regions Securities (Underwriter)