Applied Materials $2.2 billion 3.3% and 4.35% notes issues

3/4/2017
Investment grade bond/note issue

$ 2.2 billion

Completed

3/4/2017


Overview:

  • Semiconductor manufacturer supplier Applied Materials has made a $2.2 billion notes issue.
  • The issue consisted of $1.2 billion 3.3% notes due 2027 and $1 billion 4.35% notes due 2047.
  • JPMorgan Securities, Citigroup Global Markets, Credit Suisse, MUFG Securities Americas and Goldman Sachs acted as joint bookrunners.

Kurt Stumpo - Journalist

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